The 3rd European Symposium on Intelligent Materials will take place in Kiel (Germany) from 7th to 9th June 2017. Conference chairs are Christine Selhuber-Unkel and Eckhard Quandt from the Christian-Albrechts-Universität zu Kiel (Germany).
An international Program Committee will accompany the conference.
Intelligent materials with integrated functionalities are required to make devices more energy efficient, autonomous, self-responding, switchable, biocompatible, and antibacterial. They are also integrated into novel sensor and actuator devices, providing significantly increased sensitivity.
Such intelligent materials typically have complex internal structures: they can be composites of different material classes such as multiferroics; they might be nanostructured or hierarchically built-up; they could be bioinspired and possess functional elements ranging from single molecules to the macroscale.
All those materials and their design and development have to be accompanied by high-resolution analytical tools that are able to characterize the materials on all scales and, moreover, track and reveal their function-structure relations in situ or in operando.
After the successful conferences in 2013 and 2015, the 3rd European Symposium on Intelligent Materials will bring together experts in the field of intelligent materials to present and discuss recent developments and detect future trends.
The European Symposium on Intelligent Materials 2017 is an excellent forum to get in contact with international key researchers and stimulate new collaborations for developing novel intelligent material systems and characterizing their functionality, from molecular mechanisms to applications.
Further highlights of this conference will be invited speakers whose talks will cover a wide range of aspects of intelligent materials.
Over the course of the conference, a jury will judge the posters presented and choose the winners. The top three posters will each be awarded a prize!
An attractive social program will offer many opportunities for networking!
Abstracts must be submitted until December 6th 2016 via the congress website: